When the new energy and electronic information industries pursue material performance from "single indicator compliance" to the deep-water area of ​​"surface/interface collaborative control", the value coordinates of powder materials are being redefined - it is no longer just "how finely they are ground", but "how to design the interface and how to graft the functions."

On November 16-17, 2026, in Gucheng, Xiangyang, Hubei, at the 2026 New Energy and New Materials Industry Development Forum and the Moving Celebration of Yifu Intelligent Hubei New Industrial Park, a scholar who has long been deeply involved in powder engineering, functional ceramics and composite materials interfaces Confirmed to be present - Chen Deliang, professor of the School of Materials Science and Engineering of Dongguan Institute of Technology and PI of the advanced ceramics and functional composite materials team, will give a special report on "From Powder Modification to Thermal Management/Electronic Packaging Applications - Functional Powder Surface/Interface Design and Application Exploration".

Engineering scholars who build powders, ceramics and functional composite materials into industrial bridges

Chen Deliang——Ph.D., professor, doctoral supervisor, graduated from Central South University with bachelor's degree and master's degree, and graduated from Shanghai Institute of Ceramics, Chinese Academy of Sciences with a doctorate. He has engaged in visiting research at Waseda University in Japan, KAIST in South Korea, Nagaoka University of Technology in Japan, and Université Libre de Bruxelles in Belgium. Since 2016, he has participated in the construction of a high-level polytechnic university at Dongguan Institute of Technology as a subject leader. He served as the founding vice dean of the School of Materials Science and Engineering, and currently serves as the administrative vice dean of the School of Materials Science and Engineering, executive director of the Guangdong Provincial High-Performance Copper Clad Laminate Key Materials Engineering Technology Research Center, director of the provincial school-enterprise joint innovation laboratory, and PI of the advanced ceramics and functional composite materials team.

Research directions cover low-dimensional micro-nano functional materials, green hydrogen and low-carbon energy catalysis, lithium/sodium energy storage and solid-state technology, powder engineering and surface modification, solid waste recycling and advanced ceramic composite materials. Hosted/participated in more than 30 national key R&D programs, National Natural Science Foundation, Guangdong Provincial Key Fund and enterprise cooperation projects; in Advanced Functional Materials, Energy Storage Materials, Chemical Engineering Journal, Journal of Advanced Ceramics He has published about 200 papers in journals, about 50 authorized invention patents, and published 6 monographs/textbooks. He was selected into the annual and career influence list of the top 2% of scientists in the world at Stanford University. He is the winner of the Henan Provincial Outstanding Youth Fund, an academic and technological leader in Henan Province, and a featured talent in Dongguan City.

He is not a scholar who only does "material synthesis" - from the ultra-fine dispersion and surface coating of mineral powders, to the thermal conductivity control of ceramic fillers in copper-clad laminates, to the customization of functional powders in electronic packaging and thermal management scenarios, Chen Deliang's research has always been stuck at the interface of "powder modification-interface design-end application".

Functional powder surface/interface: qualitative change from "grinding" to "design"

The application of powder materials in the fields of thermal management and electronic packaging has long faced an invisible ceiling: no matter how good the performance of the powder itself is, if the surface energy and interface compatibility are not adequate, it will become a source of thermal resistance or a stress concentration point after being filled into the matrix.

Professor Chen Deliang's judgment is very clear - the competition for functional powders has shifted from "particle size involution" to "surface/interface engineering":

• Surface modification: regulating the surface energy of powders through coupling agents, inorganic coatings, in-situ polymerization and other means to solve the problems of dispersion and interfacial adhesion of inorganic fillers in organic matrices;

• Thermal conduction path construction: Using functional powders such as boron nitride, aluminum nitride, and silicon oxide as basic elements, through morphology control and surface treatment, a continuous thermal conduction network is built in adhesives, copper-clad laminates, and TIM materials;

• Electronic packaging adaptation: In response to the stringent requirements for CTE matching, dielectric properties, and moisture absorption for chip-level and module-level packaging, the powder particle size distribution and surface chemical state are reversely designed;

• Process amplification: Whether the powder modified in the laboratory can be consistent in batches on mass-produced grinding and dispersing equipment is the last hurdle for industrialization.

As he often emphasizes: "The powder is not as fine as possible, but it must be in the right matrix, with the right interface state, and appear in the right position - this is the real threshold for functional powders."

Horizontal extension of the theme of the forum "New Energy and New Materials"

In this forum, Professor Chen Deliang stretched his vision horizontally from "energy materials" to "electronic information functional materials" - both share the same underlying logic: how to make powders.

• Technical dimension: How surface/interface modification determines the final performance of functional powders in thermal interface materials, copper clad laminates, and encapsulants;

• Equipment dimension: Yifu Intelligent’s grinding and dispersing system not only grinds the powder fine, but also provides a process window for surface modification and uniform dispersion;

• Industrial dimension: 5G, AI computing power, and new energy vehicle electronic control systems have exploded the demand for high thermal conductivity and low dielectric materials. The functional powder market is moving from a "supporting role" to a "stuck link";

• Collaborative dimension: How to iterate simultaneously among the three parties of material modification, equipment technology, and terminal verification to avoid "the material is made but the production line cannot handle it."

Just like the positioning of Yifu Intelligent New Industrial Park - from "grinding and dispersing equipment supplier" to "new energy and electronic information material powder engineering overall solution provider".

In November, the new park will be opened in Gucheng, and the interface password of functional powder will be revealed soon

Professor Chen Deliang will explain the entire link of functional powder from laboratory modification to thermal management and electronic packaging production line application: which surface treatment processes are already qualified for mass production, which application scenarios are still waiting for breakthroughs on the powder side, and which problems essentially need to be solved by returning to the process window of grinding and dispersing equipment. For participating material companies, electronic packaging manufacturers and equipment suppliers, the value of this report does not lie in explaining the powder basics again, but in how to play the "table/interface design" card on the table.

2026 New Energy and New Materials Industry Development Forum and Yifu Intelligent Hubei New Industrial Park Moving Celebration

Time: November 16-17, 2026 | Location: Gucheng, Xiangyang, Hubei, China

Speaker: Professor Chen Deliang (Professor of the School of Materials Science and Engineering, Dongguan Institute of Technology, PI of the Advanced Ceramics and Functional Composite Materials Team)

Speech Topic: From Powder Modification to Thermal Management/Electronic Packaging Applications - Functional Powder Surface/Interface Design and Application Exploration

Host: Guangdong Yifu Intelligent Equipment Co., Ltd.

Co-organized by: Shanghai Nonferrous Metal Network

Co-organized by: Central South University

Supported by: Gucheng County People's Government